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Addgene

SMT000
(Plasmid #216849)

Ordering

This material is available to academics and nonprofits only.
Item Catalog # Description Quantity Price (USD)
Plasmid 216849 Standard format: Plasmid sent in bacteria as agar stab 1 $89

Backbone

  • Vector backbone
    pSB1C3
  • Backbone manufacturer
    iGEM
  • Backbone size w/o insert (bp) 1670
  • Total vector size (bp) 2741
  • Modifications to backbone
    sfGFP gene inserted, T7 promoter added upstream of sfGFP
  • Vector type
    Bacterial Expression, Synthetic Biology

Growth in Bacteria

  • Bacterial Resistance(s)
    Chloramphenicol, 25 μg/mL
  • Growth Temperature
    37°C
  • Growth Strain(s)
    DH5alpha
  • Copy number
    High Copy

Gene/Insert

  • Gene/Insert name
    Superfolder Green Fluorescent Protein
  • Alt name
    sfGFP
  • Species
    Synthetic; A. victoria
  • Mutation
    S30R, Y39N, N105T, Y145F, I171V, and A206V
  • GenBank ID
    L29345.1
  • Promoter T7

Cloning Information

Resource Information

  • Supplemental Documents
  • A portion of this plasmid was derived from a plasmid made by
    The SMT000 plasmid was a gift from Akshay Maheshwari, Endy Lab, Stanford University.

Terms and Licenses

  • Academic/Nonprofit Terms
  • Industry Terms
    • Not Available to Industry
Trademarks:
  • Zeocin® is an InvivoGen trademark.

Depositor Comments

Please visit https://doi.org/10.1101/2024.03.01.583031 for bioRxiv preprint.

How to cite this plasmid ( Back to top)

These plasmids were created by your colleagues. Please acknowledge the Principal Investigator, cite the article in which the plasmids were described, and include Addgene in the Materials and Methods of your future publications.

  • For your Materials & Methods section:

    SMT000 was a gift from Polly Fordyce (Addgene plasmid # 216849 ; http://n2t.net/addgene:216849 ; RRID:Addgene_216849)
  • For your References section:

    FACS-Sortable Triple Emulsion Picoreactors for Screening Reactions in Biphasic Environments. Thompson S, Zhang Y, Yang Z, Nichols LA, Fordyce PM. Adv Mater Interfaces 2024, 12 (3), 2400403. doi: 10.1002/admi.202400403. 10.1002/admi.202400403